Mini LED PCB. A finer pitch of light sources has been achieved, the pad gap has been shortened to 15~32 microns, and BT packaging substrate materials have been applied. It can achieve a more pixelated dynamic backlight effect, effectively improve screen brightness and contrast, and adapt to current product requirements and trends.
Smaller spacing, less color difference, and the best platform for special light sources
Combined with mSAP process, the best solution for MiP
To meet the requirements of various end-use applications, various high-end materials are applied
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